Years ago, home computers were powered by single-core processors, and in time, dual- and quad-core designs emerged which meant that two of four cores were placed alongside each other.

NOW, experts are looking to create 3D microprocessors, in which the cores will not be stacked next to each other, but on top of each other.

3D-Microprocessors The vertical stacking allow for a much higher transfer speed between the cores – up to 10 times faster than currently possible – as well as for improved heat efficiency and overall performance.

But, efficiency is not the only reason why 3D architectures are researched. It is predicted that the supercomputers of 2100 would theoretically use up the whole of the US’ electrical supply. A new, revolutionary cooling system that would further reduce temperatures inside future 3D microprocessors is being studied now. The architecture of 3D microprocessor and its comparison with today’s multichip can be seen in the right picture.

• The CMOSAIC project aims to boost the computing performance of central processors by a factor 10 while consuming less energy.

• It is estimated that the first 3D processors will go into selected supercomputers around 2015, but without the cooling system.

3D technology is going to provoke a new wave of next-generation technology because of ‘Avatar’. And recently, 3D technology has also become the most popular topic of next-generation IC designing technology.

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